DocumentCode
1717753
Title
Measurements and modeling of the temperature dependent material behavior of underfill encapsulants
Author
Islam, M. Saiful ; Suhling, Jeffrey C. ; Lall, Pradeep ; Xu, Baohua ; Johnson, R. Wayne
Author_Institution
Auburn University
fYear
2003
Firstpage
1636
Lastpage
1643
Keywords
Assembly; Electronic packaging thermal management; Flip chip; Laminates; Material properties; Materials reliability; Materials testing; Soldering; Temperature dependence; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216519
Filename
1216519
Link To Document