Title :
Measurements and modeling of the temperature dependent material behavior of underfill encapsulants
Author :
Islam, M. Saiful ; Suhling, Jeffrey C. ; Lall, Pradeep ; Xu, Baohua ; Johnson, R. Wayne
Author_Institution :
Auburn University
Keywords :
Assembly; Electronic packaging thermal management; Flip chip; Laminates; Material properties; Materials reliability; Materials testing; Soldering; Temperature dependence; Tensile stress;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216519
