• DocumentCode
    1717981
  • Title

    3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects

  • Author

    Zou, Yida ; Lau, John ; Catnerlo, S.

  • Author_Institution
    Cisco Systems
  • fYear
    2003
  • Firstpage
    1684
  • Lastpage
    1690
  • Keywords
    Assembly; Creep; Electronic waste; Environmentally friendly manufacturing techniques; Lead; Light sources; Soldering; Surface emitting lasers; Thermal stresses; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216528
  • Filename
    1216528
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1717981