Title :
3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects
Author :
Zou, Yida ; Lau, John ; Catnerlo, S.
Author_Institution :
Cisco Systems
Keywords :
Assembly; Creep; Electronic waste; Environmentally friendly manufacturing techniques; Lead; Light sources; Soldering; Surface emitting lasers; Thermal stresses; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216528
