• DocumentCode
    1718190
  • Title

    Intermittency study of a stressed-metal micro-spring sliding electrical contact

  • Author

    Chow, Eugene M. ; Klein, Kevin ; Fork, David K. ; Hamschel, T. ; Chua, Christopher L. ; Wong, Lai ; Van Schuylenbergh, Koenraad

  • Author_Institution
    Palo Alto Research Center (PARC)
  • fYear
    2003
  • Firstpage
    1714
  • Lastpage
    1717
  • Keywords
    Contacts; Gold; Integrated circuit interconnections; Packaging; Soldering; Springs; Substrates; Thermal expansion; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216533
  • Filename
    1216533