• DocumentCode
    1718245
  • Title

    Analysis of solder joint fracture under mechanical bending test

  • Author

    Harada, Kozo ; Baba, Shinji ; Wu, Qiang ; Matsushima, Hironori ; Matsunaga, Toshihiro ; Ucgai, Y. ; Kimura, Michitaka

  • Author_Institution
    Mitsubishi Electric Corp.
  • fYear
    2003
  • Firstpage
    1731
  • Lastpage
    1737
  • Keywords
    Assembly; Bars; Capacitive sensors; Circuit testing; Packaging; Performance evaluation; Research and development; Resins; Soldering; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216536
  • Filename
    1216536
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718245