DocumentCode

1718255

Title

Investigations of void forming and shear strength of Sn42Bi58 solder joints for low cost applications

Author

Herzog, Th. ; Wolter, K.-J. ; Poetzsch, F.

Author_Institution

Dresden University of Technology

fYear

2003

Firstpage

1738

Lastpage

1745

Keywords

Assembly; Chemistry; Costs; Environmentally friendly manufacturing techniques; Lead; Reflow soldering; Resistors; Temperature; Testing; Tin alloys;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216537

Filename

1216537