DocumentCode
1718283
Title
Crack length analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies
Author
Kim, Donghyun ; Filho, Jose Marcio Dias ; Park, Changyoung ; Mawer, Andrew ; Moon, Tess J. ; Masada, Glenn Y.
Author_Institution
The University of Texas at Austin
fYear
2003
Firstpage
1746
Lastpage
1753
Keywords
Aging; Assembly; Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Semiconductor device packaging; Soldering; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216538
Filename
1216538
Link To Document