Title :
A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces
Author :
Lee, Chu-Chung ; Tran, Tu-Anh ; Yong, Lois ; Harun, Fuaida ; Yong, C.C.
Author_Institution :
Motorola Inc.
Keywords :
Aging; Aluminum; Assembly; Ceramics; Copper; Oxidation; Testing; Vehicles; Wafer bonding; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216540
