DocumentCode
1718365
Title
Characterisation of intermetallic Aging in flip chip solder bumps
Author
Liu, Changqing ; Li, Dezhi ; Conway, Paul
Author_Institution
Loughborough University
fYear
2003
Firstpage
1767
Lastpage
1771
Keywords
Aging; Environmentally friendly manufacturing techniques; Flip chip; Gold; Intermetallic; Lead; Microstructure; Nickel; Optical microscopy; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216541
Filename
1216541
Link To Document