DocumentCode
1718446
Title
Analysis of flip-chip packaging challenges on copper low-k interconnects
Author
Mercado, Lei L. ; Goldberg, Cmdy ; Shun-Meen Koo ; Lee, Tien-Yu Tom ; Pozer, S.
Author_Institution
Motorola Inc.
fYear
2003
Firstpage
1784
Lastpage
1790
Keywords
Adhesives; Artificial intelligence; Capacitance; Conductivity; Copper; Delay; Dielectric materials; Integrated circuit interconnections; Packaging; Polymer films;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216544
Filename
1216544
Link To Document