DocumentCode
1718500
Title
Adhesion improvement of thermoplastic conductive adhesives under humid environment
Author
Moon, K. ; Rockett, C. ; Kretz, C. ; Burgoyne, W.F. ; Wong, C.P.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
1791
Lastpage
1799
Keywords
Aging; Chemical technology; Conductive adhesives; Contact resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Materials science and technology; Polymers; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216545
Filename
1216545
Link To Document