• DocumentCode
    1718500
  • Title

    Adhesion improvement of thermoplastic conductive adhesives under humid environment

  • Author

    Moon, K. ; Rockett, C. ; Kretz, C. ; Burgoyne, W.F. ; Wong, C.P.

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    1791
  • Lastpage
    1799
  • Keywords
    Aging; Chemical technology; Conductive adhesives; Contact resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Materials science and technology; Polymers; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216545
  • Filename
    1216545