Title :
Adhesion improvement of thermoplastic conductive adhesives under humid environment
Author :
Moon, K. ; Rockett, C. ; Kretz, C. ; Burgoyne, W.F. ; Wong, C.P.
Author_Institution :
Georgia Institute of Technology
Keywords :
Aging; Chemical technology; Conductive adhesives; Contact resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Materials science and technology; Polymers; Solvents;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216545
