Title :
First fully CMOS-integrated 3D Hall probe
Author :
Kejik, P. ; Schurig, E. ; Bergsma, F. ; Popovic, R.S.
Author_Institution :
Ecole Polytech. Fed. de Lausanne, Switzerland
Abstract :
We present the first fully CMOS-integrated 3D Hall probe. The microsystem is developed for precise magnetic field measurements in the range from mT up to tens of tesla in the frequency range from DC to 30 kHz and with a spatial resolution of about 150 μm. The microsystem is realized in a conventional CMOS process without any additional processing step and can be manufactured at very low cost. With the electronics circuit applying the so-called spinning-current technique to the Hall sensor block, we obtain low noise (a resolution better than 100 μT) and low cross talk between the channels (less than 0.2% between the channels up to 2 T). The single chip configuration insures a precision of the orthogonality between the measurement axes better than 0.5°. A temperature sensor based on a band-gap cell is integrated directly on the chip, which allows a good temperature drift compensation of the system.
Keywords :
CMOS integrated circuits; Hall effect transducers; error compensation; magnetic field measurement; magnetic sensors; microsensors; 0 Hz to 30 kHz; CMOS-integrated 3D Hall probe; Hall probe microsystem; band-gap cell temperature sensor; low cross talk; magnetic field measurements; measurement axes orthogonality; measurement spatial resolution; spinning-current technique; temperature drift compensation; CMOS process; Costs; Electronic circuits; Frequency; Hall effect devices; Magnetic field measurement; Manufacturing processes; Noise measurement; Spatial resolution; Temperature sensors;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496420