DocumentCode
1718670
Title
Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAs
Author
Shook, R.L. ; Gilbert, J.J. ; Thomas, E. ; Vaccaro, B.T. ; Dairo, A. ; Horvath, C. ; Libricz, G.J. ; Crouthamel, D.L. ; Gerlach, D.L.
Author_Institution
Agere Systems
fYear
2003
Firstpage
1823
Lastpage
1828
Keywords
Assembly; Delamination; Electronics packaging; Inspection; LAN interconnection; Lead; Moisture measurement; Plastic packaging; Robustness; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216551
Filename
1216551
Link To Document