DocumentCode
1718687
Title
Lead-free wave soldering development for pcb assembly
Author
Sunappan, Vasudivan ; Collier, Peter
Author_Institution
Singapore Institute of Manufacturing Technology
fYear
2003
Firstpage
1829
Lastpage
1838
Keywords
Assembly; Atmosphere; Atmospheric waves; Environmentally friendly manufacturing techniques; Lead; Production; Soldering; Surface resistance; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216552
Filename
1216552
Link To Document