DocumentCode

1718708

Title

Thermal limits in reflow soldering process

Author

Svasta, Paul ; Simion-Zanescu, Daniel

Author_Institution

Politchnica University of Bucharest

fYear

2003

Firstpage

1839

Lastpage

1842

Keywords

Assembly; Automatic control; Heat transfer; Infrared heating; Inspection; Ovens; Reflow soldering; Surface treatment; Temperature; Ventilation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216553

Filename

1216553