Title :
Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies
Author :
Xiao, Guo-Wei ; Gong, Jing-Feng ; Yau, Esther W C ; Chan, Philip C H ; Lee, Ricky S W ; Yuen, Matthew M F
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Artificial intelligence; Copper; Fabrication; Gold; Mechanical engineering; Printing; Resists; Scanning electron microscopy; Sputtering; Throughput;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216556
