Title :
Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications
Author :
Yau, Esther W C ; Hong, Benny F W ; Chan, Philip C.H.
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Analysis of variance; Bonding processes; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Flip chip; Lead; Ovens; Temperature; Wafer bonding;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216557
