DocumentCode
1718790
Title
Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications
Author
Yau, Esther W C ; Hong, Benny F W ; Chan, Philip C.H.
Author_Institution
Hong Kong University of Science and Technology
fYear
2003
Firstpage
1856
Lastpage
1861
Keywords
Analysis of variance; Bonding processes; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Flip chip; Lead; Ovens; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216557
Filename
1216557
Link To Document