Title :
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy
Author :
Zhang, Qian ; Dasgupta, Abhijit ; Haswell, Peter
Author_Institution :
University of Maryland
Keywords :
Consumer electronics; Creep; Electronic waste; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Legislation; Plastics; System testing; Temperature distribution;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216558
