• DocumentCode
    1718840
  • Title

    SMT process robustness and board level solder joint reliability of C2BGA

  • Author

    Zhou, Tiao ; Villa, Claudio M. ; Tee, Tong Yan ; Du, Haibin

  • Author_Institution
    STMicroelectronics
  • fYear
    2003
  • Firstpage
    1869
  • Lastpage
    1874
  • Keywords
    Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials reliability; Robustness; Soldering; Surface-mount technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216559
  • Filename
    1216559
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718840