Title :
Microlens array and micro clampers for high performance optoelectronic devices packaging
Author :
Nallani, Arun Kumar ; Chen, Ting ; Lee, J.B. ; Hayes, Donald J. ; Wallace, David B.
Author_Institution :
Dept of Electr. Eng., Texas Univ., Richardson, TX, USA
Abstract :
We report a new method of optoelectronic (OE) devices (e.g., vertical cavity surface emitting laser (VCSEL) and photodiode (PD)) packaging which uses an inkjet printed microlens array, self-aligning (alignment accuracies <2 μm after final assembly) micro clampers and inkjet printed reflowed solder in micro molds for greatly improved OE devices packaging, resulting in high efficiency optical coupling (>80%) and OE interconnects.
Keywords :
clamps; electronics packaging; microassembling; microlenses; moulding; optical interconnections; optoelectronic devices; photodiodes; reflow soldering; surface emitting lasers; 80 percent; OE devices packaging; OE interconnects; VCSEL; high efficiency optical coupling; inkjet printed microlens array; inkjet printed reflowed solder; micromolds; optoelectronic device packaging; photodiode; self-aligning microclampers; vertical cavity surface emitting laser; wafer level microoptic elements; Assembly; Lenses; Microoptics; Optical arrays; Optical coupling; Optoelectronic devices; Packaging; Photodiodes; Surface emitting lasers; Vertical cavity surface emitting lasers;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496445
