Title :
Resonance-free HRS MEMS package for microwave and millimeter-wave
Author :
Song, Yo-Tak ; Ono, Takahito ; Lee, Hai-Young ; Esash, Masayoshi
Author_Institution :
Graduate Sch. of Eng., Tohoku Univ., Sendai, Japan
Abstract :
A silicon (Si) micro electro mechanical system (MEMS) package using a lightly-doped Si chip carrier for coplanar waveguide (CPW) microwave and millimeter-wave integrated circuits (MMICs) is proposed in order to reduce parasitic problems of leakage, coupling, and resonance. The proposed chip carrier scheme is verified by fabricating and measuring a high resistivity silicon (HRS, 10 kΩ·cm) CPW on three types of carriers (conductor-back metal, lightly-doped Si, and HRS) in the frequency range 0.5 to 40 GHz. The proposed MEMS package using the lightly-doped (15 Ω·cm) Si chip carrier and the HRS shows low loss and is resonance-free since the lightly-doped Si chip carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss (S21) of 2.0 dB, a reflection loss (S11) of 10 dB, and a power loss (PL) of 6.0 dB up to 40 GHz.
Keywords :
MIMIC; circuit resonance; coplanar waveguides; coupled circuits; electronics packaging; elemental semiconductors; micromechanical devices; silicon; 0.5 to 40 GHz; 10 dB; 2.0 dB; 6.0 dB; CPW; MMIC; Si; conductor-back metal carrier; coplanar waveguides; coupling; high resistivity silicon; lightly-doped chip carrier; microwave integrated circuits; millimeter-wave integrated circuits; parasitic problems; resonance-free HRS MEMS package; resonant leakage absorption; Coplanar waveguides; Coupling circuits; Integrated circuit packaging; MMICs; Mechanical systems; Micromechanical devices; Millimeter wave integrated circuits; Millimeter wave measurements; Resonance; Silicon;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496446