• DocumentCode
    1719202
  • Title

    Review of statistical testing of solid insulating materials

  • Author

    Morcos, M.M. ; Cherukupalli, S.E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Kansas State Univ., Manhattan, KS, USA
  • fYear
    1989
  • Firstpage
    574
  • Lastpage
    581
  • Abstract
    Different statistical methods used for the determination of the insulation characteristics of solid insulating materials are reviewed. Experimental results reported in the literature indicate that the breakdown probability of the test voltages is a function of the test method, of their parameters, and of the nature of the breakdown probability function. The application of statistical methods to establish the insulation strength and lifetime is described. Techniques for determining withstand voltages of electrical insulation and for determining the low probability of breakdown of solid insulation from critical flashover data are discussed. The application of the Weibull distribution for the description of breakdown data is examined. It is noted that great care must be used in interpreting statistical test results, due to the flexibility of low-breakdown-probability test methods. Example test results are presented for three groups of epoxy specimens
  • Keywords
    electric breakdown of solids; flashover; insulation testing; materials testing; polymers; reviews; statistical analysis; Weibull distribution; breakdown probability; critical flashover; electrical insulation; epoxy specimens; insulation strength; review; solid insulating materials; statistical testing; test voltages; Breakdown voltage; Cables; Dielectrics and electrical insulation; Electric breakdown; Gaussian distribution; Insulation testing; Materials testing; Probability; Solids; Statistical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1989., Proceedings of the 3rd International Conference on
  • Conference_Location
    Trondheim
  • Type

    conf

  • DOI
    10.1109/ICSD.1989.69262
  • Filename
    69262