• DocumentCode
    1719431
  • Title

    High temperature surface measurements using lifetime imaging of thermographic phosphors: bonding tests

  • Author

    Allison, S.W. ; Beshears, D.L. ; Gadfort, Thomas ; Bencic, T. ; Eldridge, J. ; Hollerman, W.A. ; Boudreaux, P.

  • Author_Institution
    Oak Ridge Nat. Lab., TN, USA
  • fYear
    2001
  • fDate
    8/1/2001 12:00:00 AM
  • Firstpage
    171
  • Lastpage
    176
  • Abstract
    Temperature-sensitive paint (TSP) comprised of thermally sensitive phosphor can provide a viable means for noncontact thermometry in wind tunnel and other aeropropulsion applications. Described here are recent results aimed at developing a phosphor and binder system that will cover a wide temperature range, ambient to 1000°C. The phosphor/binder mixture is to be sprayed directly on the surface with an airbrush. Whereas many surfaces are candidates for various uses, the present effort concerned silicon carbide, silicon nitride and silica substrates. Initial tests show that a phosphor mixture with two water-soluble materials, designated LK and HPC and manufactured by ZYP Inc., adhered well to these substrates. This same material was earlier shown to function well on a high strength nickel alloy
  • Keywords
    fluorescence; high-temperature techniques; infrared imaging; optical sensors; phosphors; radiative lifetimes; temperature measurement; temperature sensors; wind tunnels; 20 to 1000 C; aeropropulsion applications; binder system; bonding tests; fluorescence emission spectra; high temperature surface measurements; lifetime imaging; noncontact thermometry; temperature-sensitive paint; thermally sensitive phosphor; thermographic phosphors; water-soluble materials; wind tunnel applications; Manufacturing; Materials testing; Paints; Phosphors; Silicon carbide; Silicon compounds; Spraying; Temperature distribution; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation in Aerospace Simulation Facilities, 2001. 19th International Congress on ICIASF 2001
  • Conference_Location
    Cleveland, OH
  • Print_ISBN
    0-7803-7022-8
  • Type

    conf

  • DOI
    10.1109/ICIASF.2001.960248
  • Filename
    960248