Title : 
Vacuum packaged single crystal silicon gyroscope with sub mdeg/s/√Hz resolution
         
        
            Author : 
Lee, June-Youna ; Jeon, Seung-Hoon ; Jung, Hyoung-Kyoon ; Chang, Hyun-Kee ; Kim, Yong-Kweon
         
        
            Author_Institution : 
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
         
        
        
        
        
            Abstract : 
The paper describes two models of vacuum packaged single crystal silicon gyroscope. A design rule for low noise gyroscopes is suggested, and a lateral vibrating gyroscope was fabricated through a metal interlaid SiOG technology. High aspect ratio (20:1) silicon structures were fabricated without footing damage. An easy method for the electric connection of feed through holes that are 150 μm in diameter is suggested for a vacuum package of SiOG structure. A comb model gyroscope exhibits a noise floor of 0.4 mdeg/s/√Hz, and a bias stability of 4.7 mdeg/s (17 deg/hour), where the scale factor is 68.5 mV/deg/s with 0.6% linearity error for the range of 200 deg/s. A parallel plate model exhibits a noise floor of 1.6 mdeg/s/√Hz, and a bias stability of 33.9 mdeg/s (122 deg/hour), where the scale factor is 68.5 mV/deg/s with 3.8% linearity error for the range of 200 deg/s.
         
        
            Keywords : 
gyroscopes; micromachining; microsensors; semiconductor device packaging; silicon; silicon-on-insulator; 150 micron; Si; bias stability; comb model gyroscope; gyroscope fabrication process; high aspect ratio; lateral vibrating gyroscope; linearity error; metal interlaid silicon-on-glass technology; noise floor; parallel plate gyroscope; scale factor; vacuum packaged single crystal silicon gyroscope; Capacitance; Electrodes; Gyroscopes; Integrated circuit noise; Laboratories; Linearity; Packaging; Q factor; Silicon; Stability;
         
        
        
        
            Conference_Titel : 
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
         
        
            Print_ISBN : 
0-7803-8994-8
         
        
        
            DOI : 
10.1109/SENSOR.2005.1496471