DocumentCode
1719915
Title
Technology and integration of poly-crystalline diamond piezoresistive position sensor for cochlear implant probe
Author
Tang, Yuxing ; Aslam, Dean M. ; Wang, Jianbai ; Wise, Kensall D.
Author_Institution
Micro & Nano Technol. Lab., Michigan State Univ., East Lansing, MI, USA
Volume
1
fYear
2005
Firstpage
543
Abstract
The possible use of polycrystalline diamond (poly-C) as a piezoresistive position sensor in a cochlear prosthesis is being investigated for the first time. The fabrication process of the poly-C thin film was optimized for compatibility and integration with the Si-based bulk micromachining technology of the cochlear probe. In-situ doped poly-C, films, with a thickness of 1 μm, were grown on insulating substrates using MPCVD and patterned by ECR-assisted plasma etching. The piezoresistors can be used as position sensors to detect the curvature and position of the probe during implant surgery. The film quality, electrical properties, contact resistance and piezoresistivity of the poly-C sensors were characterized, which demonstrated a successful integration of diamond technology with the microsystem technology. A gauge factor of 28 was achieved for the poly-C sensors on the probe.
Keywords
chemical vapour deposition; curvature measurement; diamond; elemental semiconductors; etching; hearing aids; piezoresistive devices; position measurement; prosthetics; strain gauges; 1 micron; C; ECR-assisted plasma etching patterning; MPCVD; cochlear implant probe; cochlear prosthesis; curvature detection; gauge factor; implant surgery; micromachining technology; piezoresistors; poly-C thin film; polycrystalline diamond piezoresistive position sensor; strain gauges; Cochlear implants; Fabrication; Insulation; Micromachining; Piezoresistance; Probes; Prosthetics; Sensor phenomena and characterization; Substrates; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN
0-7803-8994-8
Type
conf
DOI
10.1109/SENSOR.2005.1496474
Filename
1496474
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