• DocumentCode
    1720739
  • Title

    Alternative fabrication methods for capillary electrophoretic device manufacturing

  • Author

    Conklin, John A. ; Crain, Mark M. ; Pai, Rekha S. ; Martin, M. ; Pitts, K. ; Roussel, Thomas J. ; Jackson, Doug J. ; Baldwin, Richard P. ; Keynton, Robert S. ; Naber, John F. ; Walsh, Kevin M.

  • Author_Institution
    Dept. of Electr. Eng., Louisville Univ., KY, USA
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Firstpage
    83
  • Lastpage
    85
  • Abstract
    This work represents research that explores the development of novel manufacturing methods to create microcapillary electrophoretic (CE) devices. Nontraditional substrates that were investigated include polymers such as SU-8, poly dimethylsiloxane (PDMS), acetate, Riston, Kapton, polyimide, and polyester. Hot embossing, chemical etching, micro-molding, wafer level bonding, chemical treatment, and lamination techniques were developed for these substrates. The purpose of this paper is to explore the feasibility of micromachining a select group of alternative materials
  • Keywords
    capillarity; electrophoresis; etching; laminates; microfluidics; micromachining; moulding; polymers; surface treatment; wafer bonding; Kapton; PDMS; Riston; SU-8; acetate; capillary electrophoretic device manufacturing; chemical etching; chemical treatment; fabrication methods; hot embossing; lamination techniques; manufacturing method development; micro-molding; microcapillary electrophoretic devices; micromachining; poly dimethylsiloxane; polyester; polyimide; polymer substrates; wafer level bonding; Chemicals; Embossing; Etching; Fabrication; Lamination; Manufacturing; Micromachining; Polyimides; Polymers; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
  • Conference_Location
    Richmond, VA
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-6691-3
  • Type

    conf

  • DOI
    10.1109/UGIM.2001.960299
  • Filename
    960299