Title :
AC electrical breakdown and conduction in PMMA thin films and the influence of LiClO4 as an ionic impurity
Author :
Miyairi, Keiichi ; Itoh, Eiji
Author_Institution :
Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
Abstract :
Poly(methyl methacrylate) ( PMMA ) has been widely used in electrical insulator and optical device applications. It is known to be polar material, especially above the glass transition temperature Tg (∼110°C). In this work we have measured the breakdown strength of PMMA thin films of 300nm thickness between Al electrodes under alternating voltage at frequencies between 10Hz and 3kHz. Below Tg, the breakdown strength increases gradually from 2 MV/cm to 3 MV/cm as the frequency is increased. On the other hand, the breakdown strength decreases drastically at a temperature near Tg. Above Tg, the breakdown strength decreases with the frequency. The decrease in the breakdown strength at high temperature is considered in terms of heating due to the rotation of polar side chains in PMMA. We have also investigated the influence of the addition of ionic impurities (LiClO4) on the ac breakdown strength and also on the electrical conduction in PMMA films. While the breakdown strength decreases considerably with the concentration of LiClO4 at low temperature, it changes little at high temperature although there is a considerable increase in the conduction current.
Keywords :
electric breakdown; electrical conductivity; glass transition; impurities; polymer films; polymer insulators; 10 Hz to 3 kHz; 300 nm; Al electrodes; LiClO4; PMMA thin films; ac breakdown strength; conduction current; electrical conduction; electrical insulator; glass transition temperature; ionic impurity; optical device applications; polar material; polar side chains; poly(methyl methacrylate); Breakdown voltage; Conducting materials; Dielectrics and electrical insulation; Electric breakdown; Frequency; Glass; Optical devices; Optical materials; Temperature; Transistors;
Conference_Titel :
Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN :
0-7803-8348-6
DOI :
10.1109/ICSD.2004.1350299