Title :
Is backside photoemission necessary? [IC failure analysis]
Author :
Albrecht, David R., II
Author_Institution :
Dominion Semicond. LLC, Manassas, VA, USA
fDate :
6/23/1905 12:00:00 AM
Abstract :
This paper presents a case to justify the purchase of commercially available, state of the art, backside-capable photoemission microscope (PEM) systems to support failure analysis and yield learning for DRAM and flash memory manufacturers. An investigation was conducted to evaluate the existing emission capabilities at Dominion Semiconductor (DSC), examine the possibility of upgrades and if necessary, visit several emission microscope manufacturers to determine which system would be best suited for use on our products
Keywords :
DRAM chips; failure analysis; flash memories; integrated circuit testing; integrated circuit yield; optical microscopy; photoemission; DRAM; IC failure analysis; backside photoemission; backside-capable photoemission microscope systems; emission capabilities; emission microscope manufacturers; failure analysis; flash memory manufacture; yield learning; Cameras; Costs; Failure analysis; Lenses; Microscopy; Packaging; Photoelectricity; Random access memory; Semiconductor device manufacture; Silicon;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
Conference_Location :
Richmond, VA
Print_ISBN :
0-7803-6691-3
DOI :
10.1109/UGIM.2001.960318
