• DocumentCode
    1721229
  • Title

    Computation of capacitance matrix of integrated-circuit interconnects using on-surface MEI method

  • Author

    Liu, Y.W. ; Lan, K. ; Mei, K.K.

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, Japan
  • Volume
    2
  • fYear
    1999
  • fDate
    11/1/1999 12:00:00 AM
  • Firstpage
    417
  • Abstract
    The on-surface MEI (OSMEI) method is successfully developed to compute the capacitance matrix of integrated-circuit interconnects. The OSMEI method uses the same mesh as MoM, but generates highly sparse matrices. The approach is verified by 2-D and 3-D examples with computing errors within 2~4 percent
  • Keywords
    MMIC; capacitance; integrated circuit interconnections; sparse matrices; IC interconnects; MMIC; capacitance matrix; highly sparse matrices; on-surface MEI method; Capacitance; Conductors; Coupling circuits; Equations; Integrated circuit interconnections; LAN interconnection; Mesh generation; Message-oriented middleware; Sparse matrices; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1999 Asia Pacific
  • Print_ISBN
    0-7803-5761-2
  • Type

    conf

  • DOI
    10.1109/APMC.1999.829892
  • Filename
    829892
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1721229