Title :
Rapid MEMS prototyping using SU-8, wafer bonding and deep reactive ion etching
Author :
Sampath, S.K. ; St.Clair, L. ; Wu, XingTao ; Ivanov, D.V. ; Wang, Q. ; Ghosh, C. ; Farmer, K.R.
Author_Institution :
Microelectron. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
fDate :
6/23/1905 12:00:00 AM
Abstract :
We describe a technique to rapidly prototype microelectromechanical systems by combining the use of (1) patterned SU-8 photoresist to form an electrically insulating spacer layer on a silicon substrate, (2) wafer bonding to affix single crystal silicon above the spacer layer, and (3) deep reactive ion etching to form suspended structures over the patterned spacer. Technical details of the wafer bonding process are presented. Experimental results from a rapidly prototyped test structure are shown. It is expected that this process will not be limited to silicon-based systems
Keywords :
micromachining; micromechanical devices; photoresists; plasma materials processing; rapid prototyping (industrial); sputter etching; wafer bonding; Si; deep reactive ion etching; electrically insulating spacer layer; microelectromechanical systems; patterned SU-8 photoresist; patterned spacer; rapid MEMS prototyping; rapidly prototyped test structure; silicon substrate; silicon-based systems; single crystal silicon; spacer layer; suspended structures; wafer bonding; wafer bonding process; Biomembranes; Electrodes; Etching; Micromechanical devices; Prototypes; Resists; Silicon; Space technology; Springs; Wafer bonding;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2001. Proceedings of the Fourteenth Biennial
Conference_Location :
Richmond, VA
Print_ISBN :
0-7803-6691-3
DOI :
10.1109/UGIM.2001.960320
