• DocumentCode
    1721462
  • Title

    Elimination of stress-induced curvature in microbolometer focal plane arrays

  • Author

    Huang, Shusen ; Li, Biao ; Zhang, Xin

  • Author_Institution
    Dept. of Manuf. Eng., Boston Univ., MA, USA
  • Volume
    1
  • fYear
    2005
  • Firstpage
    820
  • Abstract
    The paper reports a disruptive engineering approach to eliminating stress-induced curvature in cantilever-based microbolometer focal plane arrays (FPAs). Using a combination of ion beam machining and rapid thermal annealing (RTA), we successfully modified the curvatures of free-standing SiNx/Al bimaterial cantilever structures for microbolometer applications. The ion beam machining changes the surface, either by ion implantation or surface sputter etching; the RTA changes the residual stresses in bimaterials and thus modifies the FPA curvatures. Proof-of-concept experiments have shown that it is possible to achieve "flat" microbolometer structures by using these two techniques.
  • Keywords
    bolometers; focal planes; internal stresses; ion beam applications; ion implantation; micromachining; microsensors; rapid thermal annealing; sputter etching; Al; SiNx; bimaterial cantilever structures; disruptive engineering; flat microbolometer structures; ion beam machining; ion implantation; microbolometer focal plane arrays; rapid thermal annealing; residual stresses; stress-induced curvature elimination; surface sputter etching; Actuators; Artificial intelligence; Biological materials; Ion beams; Machining; Micromechanical devices; Residual stresses; Silicon compounds; Sputter etching; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
  • Print_ISBN
    0-7803-8994-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2005.1496543
  • Filename
    1496543