DocumentCode
1721462
Title
Elimination of stress-induced curvature in microbolometer focal plane arrays
Author
Huang, Shusen ; Li, Biao ; Zhang, Xin
Author_Institution
Dept. of Manuf. Eng., Boston Univ., MA, USA
Volume
1
fYear
2005
Firstpage
820
Abstract
The paper reports a disruptive engineering approach to eliminating stress-induced curvature in cantilever-based microbolometer focal plane arrays (FPAs). Using a combination of ion beam machining and rapid thermal annealing (RTA), we successfully modified the curvatures of free-standing SiNx/Al bimaterial cantilever structures for microbolometer applications. The ion beam machining changes the surface, either by ion implantation or surface sputter etching; the RTA changes the residual stresses in bimaterials and thus modifies the FPA curvatures. Proof-of-concept experiments have shown that it is possible to achieve "flat" microbolometer structures by using these two techniques.
Keywords
bolometers; focal planes; internal stresses; ion beam applications; ion implantation; micromachining; microsensors; rapid thermal annealing; sputter etching; Al; SiNx; bimaterial cantilever structures; disruptive engineering; flat microbolometer structures; ion beam machining; ion implantation; microbolometer focal plane arrays; rapid thermal annealing; residual stresses; stress-induced curvature elimination; surface sputter etching; Actuators; Artificial intelligence; Biological materials; Ion beams; Machining; Micromechanical devices; Residual stresses; Silicon compounds; Sputter etching; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN
0-7803-8994-8
Type
conf
DOI
10.1109/SENSOR.2005.1496543
Filename
1496543
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