Title :
Reliability of non-released microstructures: failure analysis and innovative solution process
Author :
Millet, O. ; Muller, P. ; Blanrue, O. ; Legrand, B. ; Collard, D. ; Buchaillot, L.
Author_Institution :
DELFMEMS, Villeneuve d´´Ascq, France
Abstract :
The paper deals with the investigation of microstructure failures due to storage between two steps of the fabrication process, and with the presentation of an innovative process avoiding these failures. Applications in fabrication process, corrective processes on released structures and reverse engineering are thanks to nanoindentation on mobile parts.
Keywords :
failure analysis; fatigue; micromachining; micromechanical devices; semiconductor device reliability; MEMS; corrective processes; dynamic fatigue analysis; fabrication process steps; failure analysis; microstructure failures; mobile parts; nanoindentation; nonreleased microstructures; reliability; reverse engineering; storage; surface micromachining; Atmospheric measurements; Electrodes; Fabrication; Failure analysis; Fatigue; Materials testing; Microstructure; Reverse engineering; Silicon; Stress;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496548
