Title :
Uniquely orienting dry micro assembly by two-stage shape recognition
Author :
Fang, Jiandong ; Böhringer, Karl F.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Abstract :
We demonstrate a completely dry, uniquely orienting and parallel micro assembly method on the basis of two-stage shape recognition between complementary features on parts and receptor sites. A dry environment benefits assembly of chips with either exposed movable microstructures or materials sensitive to liquid environments; uniquely orienting self-alignment based on complementary features works for any part shape; parallel assembly greatly increases throughput for mass production. In our experiments, 1 mm square dummy silicon parts were assembled with a defect rate of ∼2% in 10 minutes on each of two assembly templates having respectively 397 and 720 receptor sites. This assembly technique enables either wafer level packaging of micro device chips or easy part feeding and palletizing for robotic assembly systems without constraints of part shapes or materials.
Keywords :
electronics packaging; microassembling; micromechanical devices; 1 mm; 10 min; complementary features; mass production; micro assembly; micro device chips; movable microstructures; orienting dry micro assembly; parallel micro assembly method; receptor sites; two-stage shape recognition; wafer level packaging; Assembly systems; Micromanipulators; Microstructure; Packaging; Robotic assembly; Self-assembly; Shape; Silicon; Throughput; Wafer scale integration;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496613