Title :
Advanced Microwave Packaging And Interconnection Techniques
Author :
Sparks, Richard A.
Author_Institution :
Anro Engineering, Inc,
Keywords :
Application specific integrated circuits; Chip scale packaging; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microwave devices; Microwave integrated circuits; Microwave technology; Microwave theory and techniques; Sparks;
Conference_Titel :
Microwave Conference/Brazil, 1993., SBMO International
Print_ISBN :
0-7803-1288-0
DOI :
10.1109/SBMO.1993.589542
