• DocumentCode
    1722393
  • Title

    Advanced Microwave Packaging And Interconnection Techniques

  • Author

    Sparks, Richard A.

  • Author_Institution
    Anro Engineering, Inc,
  • Volume
    1
  • fYear
    1993
  • Firstpage
    237
  • Lastpage
    237
  • Keywords
    Application specific integrated circuits; Chip scale packaging; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microwave devices; Microwave integrated circuits; Microwave technology; Microwave theory and techniques; Sparks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference/Brazil, 1993., SBMO International
  • Print_ISBN
    0-7803-1288-0
  • Type

    conf

  • DOI
    10.1109/SBMO.1993.589542
  • Filename
    589542
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1722393