• DocumentCode
    172299
  • Title

    Study on applicable conditions of transmission line tower foundation natural grounding in less thunderstorm days region in Northwest China

  • Author

    Jian Jiang ; Sun Haifeng ; An Ning ; Shi Ying ; Zhang Zhongyuan ; Jing Yongming

  • Author_Institution
    Gansu Electr. Power Design Inst., Lanzhou, China
  • fYear
    2014
  • fDate
    11-18 Oct. 2014
  • Firstpage
    1604
  • Lastpage
    1609
  • Abstract
    Tower grounding of transmission line is one of the most important measure to maintain the normal operation of power system and to guarantee the security of personnel. There is no need to lay artificial grounding when the natural grounding follows the regulators. In some northwest district of China whose number of thunder is few, ground flash density and lightning trip-out rate is low and therefore the counter trip-out rate is less, especially for high pressure transmission line. If the current standard is adopted in these areas, the term is too harsh to implement with economic benefit. So, it is significant to propose a new grounding standard to be applied in northwest district of China. In this paper, we modeled the tower and its grounding body of transmission line by the electromagnetic method. Then we calculated the counter trip-out rate under the condition of natural grounding and proposed the standard of natural grounding for 750kV transmission line in less thunder region.
  • Keywords
    earthing; flashover; lightning protection; poles and towers; power transmission lines; China; counter trip-out rate; ground flash density; grounding standard; lightning trip-out rate; transmission line tower foundation natural grounding; voltage 750 kV; Grounding; Indium tin oxide; Lightning; Poles and towers; Soil; Sun; Three-dimensional displays; 750kV transmission line; lighting back flashover rate; natural grounding; tower modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lightning Protection (ICLP), 2014 International Conference o
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICLP.2014.6973386
  • Filename
    6973386