Study of dielectric material property impact on insertion loss for advanced packaging solutions

This paper evaluates the impact of dielectric loss tangent property on electrical insertion loss performance for both conventional and coreless packaging designs up-to 100Gbps datarate. Coreless package with metal grid array (MGA) second level interconnect (SLI) that yields minimal impedance discontinuities was observed gaining more than 50% insertion loss improvements i.e. ~20% higher compared to conventional design with dielectric loss tangent improved from 0.03 to 0.006.