• DocumentCode
    172335
  • Title

    Transient phenomena at point of strike for lightning strokes to concrete wall of building structures

  • Author

    Rongmei Liu ; Youhua Wang ; Zhenghan Zhao ; Yan Zhang

  • Author_Institution
    Province-Minist. Joint Key Lab. of Electromagn. Field & Electr. Apparatus Reliability, Hebei Univ. of Technol., Tianjin, China
  • fYear
    2014
  • fDate
    11-18 Oct. 2014
  • Firstpage
    1716
  • Lastpage
    1719
  • Abstract
    Tall buildings are vulnerable to suffer lightning. Lightning usually directly hits the lightning protection system (LPS) of buildings, but occasionally lightning may hit a non-conductive part of buildings, such as corner of concrete wall. In this paper, finite element method is utilized to simulate the transient phenomenon of the building suffering lightning and the transient currents flowing along the reinforcing steel bar branches are calculated. Lightning strokes to LPS is compared with lightning strokes to concrete wall, and then the variation curves of the transient electric potential and the transient impedance at the injection point are given. The trends of the transient electric potential and impedance of different concrete wall conductivity ranging from 10-7 to 100 S/m were determined.
  • Keywords
    buildings (structures); concrete; finite element analysis; lightning protection; transient analysis; walls; building LPS; building structure concrete wall; concrete wall conductivity; finite element method; lightning protection system; lightning stroke; steel bar reinforcement; strike point; transient current; transient electric potential variation curve; transient impedance; transient phenomena; Computer aided software engineering; Concrete; Conductors; Impedance; Lightning; Steel; Transient analysis; concrete wall; finite element methods; lightning protection system; tall building; transient impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lightning Protection (ICLP), 2014 International Conference o
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICLP.2014.6973405
  • Filename
    6973405