• DocumentCode
    1723637
  • Title

    Modeling and simulation of Electrostatic Adhesion for Wall Climbing Robot

  • Author

    Koh, Keng Huat ; Kuppan Chetty, R.M. ; Ponnambalam, S.G.

  • Author_Institution
    Sch.. of Eng., Monash Univ. Sunway Campus, Bandar Sunway, Malaysia
  • fYear
    2011
  • Firstpage
    2031
  • Lastpage
    2036
  • Abstract
    Electrostatic Adhesion (ESA) was chosen as the surface attachment mechanism for Wall Climbing Robot (WCR) for its qualitative advantages. ESA model was developed to account for both parallel-plane and fringing static fields. Such Electrostatic Pad model yields equations governing the ESA force and the geometrical conditions for maximum ESA pressure per pad area. This paper shows that the parameters due to applied voltage, and also geometrical properties, material properties and compliance to wall surface of the Electrostatic Pad do affect the ESA force. The simulation also shows that fringing fields may account up to above 10% of total generated ESA force.
  • Keywords
    adhesion; electrostatics; mobile robots; robot dynamics; ESA force; ESA model; ESA pressure; electrostatic adhesion; electrostatic pad model; material properties; surface attachment mechanism; wall climbing robots; Adhesives; Electrodes; Electrostatics; Force; Materials; Mathematical model; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Biomimetics (ROBIO), 2011 IEEE International Conference on
  • Conference_Location
    Karon Beach, Phuket
  • Print_ISBN
    978-1-4577-2136-6
  • Type

    conf

  • DOI
    10.1109/ROBIO.2011.6181590
  • Filename
    6181590