DocumentCode
172427
Title
Upward leader inception criterion considering gas kinetic process and heat conduction
Author
Xuan Zhou ; Rong Zeng ; Zhizhao Li ; Chijie Zhuang
Author_Institution
Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
fYear
2014
fDate
11-18 Oct. 2014
Firstpage
1960
Lastpage
1963
Abstract
Modelling of upward leader inception is important for calculating lightning shielding failure rates of transmission lines. The leader inception model proposed by Gallimberti I. has been widely adopted for about 30 years and applied in the analysis of unstable upward leader inception. However, the gas kinetic process and heat transfer via conduction are not considered in this model. Theoretical analysis and simplified simulation show that the gas density variation and heat conduction cannot be neglected. In this paper, the gas kinetics and heat conduction have been considered, and a simplified one-dimensional thermofluid dynamics (1D-TFD) model has been proposed as an upward leader inception criterion. A Mach-Zehnder interferometer was set up to observe the gas density variation in leader channel and the channel expansion. Experimental results indicate that the gas density reduction in leaders is significant, and the calculation of the channel diameter expansion has a good agreement with that obtained by experiments.
Keywords
HVDC power transmission; Mach-Zehnder interferometers; failure analysis; heat conduction; lightning protection; power transmission lines; power transmission reliability; 1D-TFD model; HYDC transmission lines; Mach-Zehnder interferometer; channel diameter expansion; gas density reduction; gas density variation; gas kinetic process; heat conduction; heat transfer; lightning shielding failure rates; one-dimensional thermofluid dynamics model; upward leader inception criterion; Lead; System-on-chip; TV; Mach-Zehnder interferometry; gas kinetics; heat conduction; inception criterion; upward leader;
fLanguage
English
Publisher
ieee
Conference_Titel
Lightning Protection (ICLP), 2014 International Conference o
Conference_Location
Shanghai
Type
conf
DOI
10.1109/ICLP.2014.6973448
Filename
6973448
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