DocumentCode :
1724978
Title :
A micro mobile mechanism using thermal expansion and its theoretical analysis. A comparison with impact drive mechanism using piezoelectric elements
Author :
Yamagata, Yutaka ; Higuchi, Toshiro ; Nakamura, Naoto ; Hamamura, Sho
Author_Institution :
Kanagawa Academy of Sci. and Technol., Kanagawa, Japan
fYear :
1994
fDate :
6/16/1905 12:00:00 AM
Firstpage :
142
Lastpage :
147
Abstract :
Thermal expansion of solid materials can be used as an actuating mechanism for micro machines. It produces as much displacement as piezoelectric elements, but has the problem of response speed for ordinary scale machines. Actuators using thermal expansion have the possibility of fast response if their sizes are small because of their high heat emission ratio. In addition there are the following advantages: simple actuator structure and easy fabrication process; various materials which can be adopted for the actuator; the ability to operate in high temperature and in vacuum; remote control by supplying heat with laser beam or RF electromagnetic wave. This paper introduces a micro motion mechanism driven by thermal expansion and then introduces a theoretical analysis on a motion mechanism using thermal expansion. In addition, a comparison with a piezoelectric element illustrates the characteristics of the actuator. A basic experiment using electric current heating type actuator shows the possibility of the thermal expansion actuator
Keywords :
thermal expansion; actuator structure; electric current heating; impact drive mechanism; micro mobile mechanism; micro motion mechanism; micromachines; piezoelectric element; piezoelectric elements; remote control; response speed; theoretical analysis; thermal expansion; Actuators; Electromagnetic heating; Laser theory; Motion analysis; Optical control; Optical device fabrication; Optical materials; Solids; Temperature control; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1994, MEMS '94, Proceedings, IEEE Workshop on
Conference_Location :
Oiso
Print_ISBN :
0-7803-1833-1
Type :
conf
DOI :
10.1109/MEMSYS.1994.555613
Filename :
555613
Link To Document :
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