• DocumentCode
    1725082
  • Title

    Anti-ESD impacts on 60-V P-channel LDMOS devices as none-ODs zone inserting in the bulk region

  • Author

    Shen-Li Chen ; Shawn Chang ; Yu-Ting Huang ; Shun-Bao Chang

  • fYear
    2015
  • Firstpage
    266
  • Lastpage
    267
  • Abstract
    For the reliability considerations, a 60-V power p-channel LDMOS transistor co-designed with none-OD zone in the bulk end by a 0.25-μm process will be evaluated in this paper. From the experimental data found that as the none-OD zones inserting, meanwhile the none-OD zone percentage was increased, the anti-ESD capability will be strengthened too, i.e. its It2 value is improved by using this manner. Nevertheless, as the none-OD zone ratio increased, the trigger voltage (Vt1) results of these samples are not changed so much, and all of the variation is in a range of 1 to 2-V. On the other hand, the on-resistance (Ron) result will be decreased, which can be considered as more even conduction. Eventually, from the TLP testing data, we can find that the anti-ESD capability (It2 value) upgraded nearly 15.4%, and on-resistance (Ron) value decreased nearly 8.6% as compared with the reference sample.
  • Keywords
    MOSFET; integrated circuit design; semiconductor device reliability; TLP testing; anti-ESD; lateral-diffuse metal-oxide-semiconductor; none-OD zone; p-channel LDMOS transistor; size 0.25 mum; voltage 1 V to 2 V; voltage 60 V; Electrostatic discharges; Fingers; Logic gates; Resistance; Robustness; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics - Taiwan (ICCE-TW), 2015 IEEE International Conference on
  • Conference_Location
    Taipei
  • Type

    conf

  • DOI
    10.1109/ICCE-TW.2015.7216890
  • Filename
    7216890