Study of rough surface to decrease reverberation noise in ultrasonic imaging

Author

Zhang, Jinying ; Han, Gang ; Chen, Shuming ; Qian, Yue ; Xu, Weijiang ; Carlier, Julien ; Nongaillard, Bertrand

Author_Institution

Sch. of Comput., Nat. Univ. of Defense Technol., Changsha, China

fYear

2012

Firstpage

509

Lastpage

512

Abstract

Rough back surface is investigated to decrease the reverberation noise in ultrasonic imaging. Silicon crystal is selected as the backing substrate of the ultrasonic transducer because rough structure is convenient to be fabricated on silicon substrate using microfabrication technologies. Different dimensions of rough boundaries are designed and simulated to scatter the undesired waves based on finite element method modeling. Transient analysis indicates that a rough surface whose dimension (including depth and width) is around 1.0 λ should be considered to scatter a majority of incident waves.

Keywords

acoustic noise; finite element analysis; reverberation; surface roughness; transient analysis; ultrasonic imaging; ultrasonic transducers; Si; Silicon crystal; backing substrate; finite element method modeling; incident waves; microfabrication; reverberation noise; transient analysis; ultrasonic imaging; ultrasonic transducer; Reflection; Reflectivity; Rough surfaces; Silicon; Surface roughness; Surface waves; Ultrasonic imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

New Circuits and Systems Conference (NEWCAS), 2012 IEEE 10th International

Conference_Location

Montreal, QC

Print_ISBN

978-1-4673-0857-1

Electronic_ISBN

978-1-4673-0858-8

Type

conf

DOI

10.1109/NEWCAS.2012.6329068

Filename

6329068