Non-contact handling and transportation for substrates and microassembly using ultrasound-air-film-technology

Author

Reinhart, Gunther ; Heinz, Michael ; Stock, Johannes ; Zimmermann, Josef ; Schilp, Michael ; Zitzmann, Adolf ; Hellwig, Jens

Author_Institution

Inst. for Machine Tools & Ind. Manage., Tech. Univ. Munchen, Munich, Germany

fYear

2011

Firstpage

1

Lastpage

6

Abstract

The requirements needing to be met by handling technologies and factory automation in semiconductor fabrication and microsystem s technology are rising relentlessly. Fragile, surface-sensitive and thinned substrates call for new, innovative approaches in order to tackle numerous material handling tasks. Therefore a new upcoming handling technology based on the ultrasound-air-film-technology and its applications for non-contact handling in PV-Thin-Film and microassembly are presented in this paper.

Keywords

factory automation; materials handling; microassembling; micromechanical devices; semiconductor device manufacture; ultrasonic applications; PV thin film; factory automation; material handling tasks; microassembly; microsystem technology; non contact handling; semiconductor fabrication; ultrasound air film technology; Acoustics; Force; Grippers; Microassembly; Photovoltaic systems; Substrates; Ultrasonic imaging; Air-Film; Microassembly; Non-contact-Handling; PV-Thin-Film; Ultrasonic; Ultrasound;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI

Conference_Location

Saratoga Springs, NY

ISSN

1078-8743

Print_ISBN

978-1-61284-408-4

Electronic_ISBN

1078-8743

Type

conf

DOI

10.1109/ASMC.2011.5898208

Filename

5898208