DocumentCode
1725840
Title
A quality metric for defect inspection recipes
Author
Buengener, Ralf ; Lee, Julie L. ; Trapp, Brian M. ; Rudy, John A.
Author_Institution
FCO TDV, GLOBALFOUNDRIES, Hopewell Junction, NY, USA
fYear
2011
Firstpage
1
Lastpage
7
Abstract
This article describes a metric that measures the quality of defect inspection recipes. It takes into account several factors including non visual (NV) rate, defect of interest (DOI) rate, defect count per wafer, and inspection time. The calculation runs automatically and only minimal user input is necessary. Different weighting models allow giving each factor more or less importance, thus making the metric flexible for different applications in development and manufacturing. The result is a final score for each recipe. A list of inspection recipes can be sorted by scores to show which recipe needs optimization. Several examples show the use of the quality metric in IBM´s East Fishkill development facility.
Keywords
Q-factor; circuit optimisation; inspection; IBM East Fishkill development facility; defect inspection recipes; defect of interest rate; metric flexible; nonvisual rate; optimization; quality metric; Adders; Inspection; Manufacturing; Measurement; Monitoring; Optimization; Semiconductor device modeling; Defect inspection; defect of interest; non visual; quality; recipe;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-61284-408-4
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2011.5898215
Filename
5898215
Link To Document