• DocumentCode
    1725840
  • Title

    A quality metric for defect inspection recipes

  • Author

    Buengener, Ralf ; Lee, Julie L. ; Trapp, Brian M. ; Rudy, John A.

  • Author_Institution
    FCO TDV, GLOBALFOUNDRIES, Hopewell Junction, NY, USA
  • fYear
    2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This article describes a metric that measures the quality of defect inspection recipes. It takes into account several factors including non visual (NV) rate, defect of interest (DOI) rate, defect count per wafer, and inspection time. The calculation runs automatically and only minimal user input is necessary. Different weighting models allow giving each factor more or less importance, thus making the metric flexible for different applications in development and manufacturing. The result is a final score for each recipe. A list of inspection recipes can be sorted by scores to show which recipe needs optimization. Several examples show the use of the quality metric in IBM´s East Fishkill development facility.
  • Keywords
    Q-factor; circuit optimisation; inspection; IBM East Fishkill development facility; defect inspection recipes; defect of interest rate; metric flexible; nonvisual rate; optimization; quality metric; Adders; Inspection; Manufacturing; Measurement; Monitoring; Optimization; Semiconductor device modeling; Defect inspection; defect of interest; non visual; quality; recipe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-61284-408-4
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2011.5898215
  • Filename
    5898215