DocumentCode
172595
Title
Origin of the deep reset and low variability of pulse-programmed WAl2 O3 TiWCu CBRAM device
Author
Belmonte, A. ; Degraeve, Robin ; Fantini, Andrea ; Kim, Wonhee ; Houssa, M. ; Jurczak, Malgorzata ; Goux, L.
Author_Institution
IMEC, Leuven, Belgium
fYear
2014
fDate
18-21 May 2014
Firstpage
1
Lastpage
4
Abstract
In this paper we demonstrate for the first time the origin of the deep reset and low switching variability obtained on pulse-programmed (100ns) 90nm-size WAl2O3TiWCuCBRAM device operated at 10 μA. To this aim we develop a Quantum-Point-Contact (QPC) model describing the conduction of the CBRAM states down to deep current levels, allowing to estimate the effective size of the defect particles in the QPC constriction. The model clearly points to smaller particles for CBRAM (Cu particles) as compared to OxRRAM (oxygen-vacancy Vo defects). As a consequence, smaller constrictions (thus larger resistance) may be obtained in CBRAM after reset. In addition, the fluctuation of the number of these small Cu particles in the constriction has lower impact on Random-Telegraph-Noise (RTN), as compared to Vo defects. Finally, the lower switching variability obtained for CBRAM as compared to OxRRAM is also attributed to the larger mobility of Cu ions as compared to Vo particles in Al2O3 medium.
Keywords
alumina; copper; integrated circuit modelling; particle size; quantum point contacts; random-access storage; titanium compounds; tungsten; OxRRAM; QPC model; RTN; W-Al2O3-TiW-Cu; conductive-bridging random access memory; current 10 muA; deep current levels; deep reset; defect particle size; low switching variability; pulse-programmed CBRAM device; quantum-point-contact model; random-telegraph-noise; size 90 nm; time 100 ns; Adaptation models; Aluminum oxide; Fitting; Fluctuations; Random access memory; Resistance; Switches; CBRAM; Conductive-bridging; ECM; QPC conduction; RTN; deep-reset; switching variability;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2014 IEEE 6th International
Conference_Location
Taipei
Print_ISBN
978-1-4799-3594-9
Type
conf
DOI
10.1109/IMW.2014.6849356
Filename
6849356
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