DocumentCode
172599
Title
Extremely small resistive random access memory test cell structure with removable and movable bottom electrode
Author
Sang-Gyu Koh ; Sawai, Yusuke ; Kishida, Satoru ; Kinoshita, Keizo
Author_Institution
Dept. of Inf. & Electron., Tottori Univ., Tottori, Japan
fYear
2014
fDate
18-21 May 2014
Firstpage
1
Lastpage
4
Abstract
We established a method of preparing an extremely small memory cell by fabricating a resistive random access memory (ReRAM) structure on the tip of a cantilever of an atomic force microscope (AFM). This structure has the high robustness against the drift of the cantilever, and the effective cell size was estimated to be less than 10 nm in diameter due to the electric field concentration at the tip of the cantilever, which was confirmed using electric field simulation. This method does not require complicated sample fabrication processes such as a photolithography and etching, and enables long-time measurement of the same filament that is confined in a tiny ReRAM structure. The proposed structure, which has a removable bottom electrode, enables the performance of unique experiments such as changing electrodes for the same filament. The proposed method is shown to be effective in finding the location of oxygen reservoir, which plays an important role in causing resistive switching by exchanging oxygen ions with the filament.
Keywords
atomic force microscopy; cantilevers; random-access storage; AFM; ReRAM structure; atomic force microscope; cantilever; changing electrodes; effective cell size; electric field concentration; electric field simulation; etching; extremely small resistive random access memory test cell structure; long-time measurement; oxygen ions; oxygen reservoir; photolithography; removable bottom electrode; resistive switching; sample fabrication processes; Electric fields; Electrical resistance measurement; Electrodes; Films; Ions; Resistance; Switches; AFM; Resistive RAM; conductive filament; tiny cell;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2014 IEEE 6th International
Conference_Location
Taipei
Print_ISBN
978-1-4799-3594-9
Type
conf
DOI
10.1109/IMW.2014.6849359
Filename
6849359
Link To Document