Materials analysis of fluorocarbon films for MEMS applications

Author

Elders, J. ; Jansen, H.V. ; Elwenspoek, M.

Author_Institution

MESA Res. Inst., Twente Univ., Enschede, Netherlands

fYear

1994

fDate

6/16/1905 12:00:00 AM

Firstpage

170

Lastpage

175

Abstract

In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results are presented

Keywords

polymer films; MEMS applications; PTFE; SF₆; X-ray photoelectron spectroscopy; XPS; fluon; fluorocarbon films; micro electro-mechanical structures; polytetrafluoroethylene; reactive ion etcher; teflon; Chemicals; Coatings; Etching; Micromechanical devices; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma properties; Plasma x-ray sources; Trademarks;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1994, MEMS '94, Proceedings, IEEE Workshop on

Conference_Location

Oiso

Print_ISBN

0-7803-1833-1

Type

conf

DOI

10.1109/MEMSYS.1994.555618

Filename

555618