• DocumentCode
    1726312
  • Title

    Control of industrial inspection modules using Kinect somatosensory technology

  • Author

    Hsu-Nan Yen ; Guan-Lin Chen ; Jui-Hsin Tsao

  • Author_Institution
    Dept. of Electron. Eng., St. John´s Univ., New Taipei, Taiwan
  • fYear
    2015
  • Firstpage
    350
  • Lastpage
    351
  • Abstract
    In recent years, the light, thin, short, small and multi-function demand of consumer electronic products has driven SMT manufactures to make their IC package component sizes continue to shrink. For improving production yields of the tiny package components, many manufacturers have produced and tested the tiny IC package components in a clean room. This study aims the tiny chip size package (CSP) components to develop a Kinect-based inspection system. The proposed system applied Kinect sensor to perform human skeleton detection. With our developed software, the operator outside the clean room can use his hand to directly control the important inspection modules such as lighting module and translation module, which are located in the clean room, through the glass window by applying somatosensory technology.
  • Keywords
    image sensors; inspection; integrated circuit packaging; object detection; surface mount technology; CSP components; IC package component size; Kinect sensor; Kinect somatosensory technology; Kinect-based inspection system; SMT manufactures; chip size package; consumer electronic products; human skeleton detection; industrial inspection modules; lighting module; surface mounting technology; translation module; Chip scale packaging; Image color analysis; Inspection; Integrated circuits; Lighting; Packaging; Robot sensing systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics - Taiwan (ICCE-TW), 2015 IEEE International Conference on
  • Conference_Location
    Taipei
  • Type

    conf

  • DOI
    10.1109/ICCE-TW.2015.7216938
  • Filename
    7216938