DocumentCode
1726312
Title
Control of industrial inspection modules using Kinect somatosensory technology
Author
Hsu-Nan Yen ; Guan-Lin Chen ; Jui-Hsin Tsao
Author_Institution
Dept. of Electron. Eng., St. John´s Univ., New Taipei, Taiwan
fYear
2015
Firstpage
350
Lastpage
351
Abstract
In recent years, the light, thin, short, small and multi-function demand of consumer electronic products has driven SMT manufactures to make their IC package component sizes continue to shrink. For improving production yields of the tiny package components, many manufacturers have produced and tested the tiny IC package components in a clean room. This study aims the tiny chip size package (CSP) components to develop a Kinect-based inspection system. The proposed system applied Kinect sensor to perform human skeleton detection. With our developed software, the operator outside the clean room can use his hand to directly control the important inspection modules such as lighting module and translation module, which are located in the clean room, through the glass window by applying somatosensory technology.
Keywords
image sensors; inspection; integrated circuit packaging; object detection; surface mount technology; CSP components; IC package component size; Kinect sensor; Kinect somatosensory technology; Kinect-based inspection system; SMT manufactures; chip size package; consumer electronic products; human skeleton detection; industrial inspection modules; lighting module; surface mounting technology; translation module; Chip scale packaging; Image color analysis; Inspection; Integrated circuits; Lighting; Packaging; Robot sensing systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics - Taiwan (ICCE-TW), 2015 IEEE International Conference on
Conference_Location
Taipei
Type
conf
DOI
10.1109/ICCE-TW.2015.7216938
Filename
7216938
Link To Document