DocumentCode
1726330
Title
CSTBT (III) as the next generation IGBT
Author
Takahashi, Tetsuo ; Tomomatsu, Yoshifumi ; Sato, Katsumi
Author_Institution
Mitsubishi Electr. Corp., Fukuoka
fYear
2008
Firstpage
72
Lastpage
75
Abstract
Recently, the performance of Si power devices gradually approaches the physical limit, and the latest SiC device seemingly has the ability to substitute the Si insulated gate bipolar transistor (IGBT) in 1200 V class. In this paper, we demonstrate the feasibility of further improving the Si IGBT based on the new concept of CSTBTtrade. In point of view of low turn-off loss and high uniformity in device characteristics, we employ the techniques of fine-pattern and retro grade doping in the design of new device structures, resulting in significant reduction on the turn-off loss and the VGE(th) distribution, respectively.
Keywords
insulated gate bipolar transistors; CSTBT; Si insulated gate bipolar transistor; Si power devices; SiC device; next generation IGBT; retrograde doping; Bipolar integrated circuits; Doping profiles; Electronic mail; Impurities; Insulated gate bipolar transistors; Large scale integration; Power semiconductor devices; Semiconductor device doping; Silicon carbide; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
978-1-4244-1532-8
Electronic_ISBN
978-1-4244-1533-5
Type
conf
DOI
10.1109/ISPSD.2008.4538900
Filename
4538900
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