• DocumentCode
    1726330
  • Title

    CSTBT (III) as the next generation IGBT

  • Author

    Takahashi, Tetsuo ; Tomomatsu, Yoshifumi ; Sato, Katsumi

  • Author_Institution
    Mitsubishi Electr. Corp., Fukuoka
  • fYear
    2008
  • Firstpage
    72
  • Lastpage
    75
  • Abstract
    Recently, the performance of Si power devices gradually approaches the physical limit, and the latest SiC device seemingly has the ability to substitute the Si insulated gate bipolar transistor (IGBT) in 1200 V class. In this paper, we demonstrate the feasibility of further improving the Si IGBT based on the new concept of CSTBTtrade. In point of view of low turn-off loss and high uniformity in device characteristics, we employ the techniques of fine-pattern and retro grade doping in the design of new device structures, resulting in significant reduction on the turn-off loss and the VGE(th) distribution, respectively.
  • Keywords
    insulated gate bipolar transistors; CSTBT; Si insulated gate bipolar transistor; Si power devices; SiC device; next generation IGBT; retrograde doping; Bipolar integrated circuits; Doping profiles; Electronic mail; Impurities; Insulated gate bipolar transistors; Large scale integration; Power semiconductor devices; Semiconductor device doping; Silicon carbide; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1532-8
  • Electronic_ISBN
    978-1-4244-1533-5
  • Type

    conf

  • DOI
    10.1109/ISPSD.2008.4538900
  • Filename
    4538900