Title :
3D finite element simulation of the delamination behaviour of a PLCC package in the temperature cycling test
Author :
Van Gestel, Richard ; Schellekens, Han
Author_Institution :
Delft Univ. of Technol., Netherlands
Abstract :
A full three-dimensional finite-element simulation performed on a model similar to a PLCC plastic package is discussed. In the model three layers of special interface elements were used to simulate the delamination behavior as observed when plastic packages are being stressed by thermal cycles. The interfaces simulated are mould-leadframe leadframe-die, and die-mould. The results of this calculation are used to evaluate the changes of stress inside the package and will be used in combination with test chips capable of measuring die surface stress in further research.<>
Keywords :
circuit reliability; delamination; electronic engineering computing; failure analysis; finite element analysis; packaging; thermal stress cracking; 3D finite element simulation; IC package reliability; PLCC plastic package; changes of stress; delamination behaviour; die-mould; leadframe-die; mould-leadframe; temperature cycling test; Acoustic measurements; Acoustic testing; Adhesives; Delamination; Electronic packaging thermal management; Finite element methods; Microscopy; Plastic packaging; Temperature; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283293
