DocumentCode
1726547
Title
Geometry effect on CMOS transistor stability under DC gate stress
Author
Chin, David ; Pan, Sam ; Wu, Ken
Author_Institution
Intel Corp., Santa Clara, CA, USA
fYear
1993
Firstpage
66
Lastpage
70
Abstract
The authors show that transistor degradation is aggravated with an increase in channel length (L) and width (W) for negative gate bias stress, different from the W/L ratio dependence for positive stress reported previously. Nonuniform interface-state generation is believed to be the dominant degradation mechanism for negative stress, whereas negative trapped charge is the prevalent cause of instability for positive stress. This geometry effect needs to be considered when estimating CMOS transistor stability.<>
Keywords
CMOS integrated circuits; circuit reliability; electron traps; hot carriers; insulated gate field effect transistors; interface electron states; semiconductor device testing; CMOS transistor stability; DC gate stress; channel length; channel width; geometry effect; negative gate bias stress; negative trapped charge; nonuniform interface state generation; transistor degradation; CMOS logic circuits; Circuit stability; Current measurement; Degradation; Digital integrated circuits; Geometry; MOS devices; MOSFETs; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-0782-8
Type
conf
DOI
10.1109/RELPHY.1993.283300
Filename
283300
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